Sanco Biotech - Precision Fluid Dispensing Equipment
Piezo Valve | High-Speed Precision Dispensing Valve | Sanco Biotech

Dispensing Valve

Piezo Valve

High-speed piezoelectric jet dispensing valve with ultra-fast response time, enabling non-contact precision dispensing for advanced electronics manufacturing applications.

Non-Contact Jet High Frequency Precise Volume
Piezo Valve

Product Description

The Piezo Valve utilizes advanced piezoelectric technology to achieve ultra-fast, non-contact jet dispensing. This innovative valve delivers exceptional precision and repeatability for demanding electronics manufacturing applications.

With its high-frequency operation capability and precise volume control, the Piezo Valve is ideal for applications requiring micro-dispensing of adhesives, solder paste, underfill materials, and other precision fluids.

Ultra-Fast Response
Millisecond-level actuation
High Frequency
Up to 1000Hz operation
Non-Contact Jet
No surface contact needed
Precise Control
Nanoliter-level accuracy

KEY FEATURES

Advanced piezoelectric technology for superior dispensing performance

Piezoelectric Actuation

Advanced piezoelectric element provides ultra-fast response and precise displacement control for consistent dispensing.

Non-Contact Dispensing

Jet dispensing technology eliminates surface contact, reducing contamination risk and enabling 3D dispensing paths.

High-Speed Operation

Capable of dispensing at frequencies up to 1000Hz, dramatically increasing production throughput.

Precise Volume Control

Nanoliter-level dispensing accuracy with exceptional repeatability for demanding micro-dispensing applications.

Wide Fluid Compatibility

Compatible with various fluids including adhesives, solder paste, underfill, silver paste, and more.

Easy Maintenance

Modular design allows for quick cleaning and maintenance, minimizing production downtime.

Applications

Precision dispensing solutions for advanced manufacturing

SMT Underfill
SMT Underfill
Solder Paste
Solder Paste
Component Packaging
Component Packaging
Semiconductor Packaging
Semiconductor Packaging
Camera Module
Camera Module
Red Glue
Red Glue
Black Glue
Black Glue
Pin Encapsulation
Pin Encapsulation

Technical Specifications

Detailed specifications for Piezo Valve

Performance
Dispensing Type
Non-Contact Jet
Operating Frequency
Up to 1000 Hz
Dispensing Volume
Nanoliter Level
Response Time
< 1 ms
Repeatability
±3%
Physical
Actuation Type
Piezoelectric
Fluid Viscosity
1 - 500,000 cps
Operating Pressure
0.1 - 6 bar
Wetted Parts
Stainless Steel / PTFE
Connection
Luer Lock / Custom

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TECHNICAL SPECIFICATIONS

Structure Specification

Complete structure specifications and material details.

Dimension Net weight Glue inlet The material of part in contact with glue Material of striker
99x78x37.5(mm) 350g SS connector SUS 304 Tungsten steel/ceramic
Heating range Heating power Fluid seal Drive mode Material of Nozzle
Room temperature to 180°C 80 W PEEK/PE/PTFE Piezoelectric Tungsten steel/ceramic
Minimum dot size Maximum dispensing frequency Adaptable glue type Temperature environment
3NL 500HZ Adhesives,binderswater solvents, etc. 0-45°