Component and Lead Encapsulation Dispensing
Adhesive encapsulation for securing components and leads on PCBs, providing bonding, sealing, and waterproof protection
Why Encapsulation Dispensing?
With the increasing level of PCB integration, electronic components on circuit boards are becoming more numerous and significantly smaller. During solder paste printing, insufficient solder on small components may result in weak bonding strength, making components prone to detachment. In addition, irregularly shaped components, ICs with leaded packages, and large components often require adhesive dispensing for reinforcement.
Advanced Adhesive Technology
The adoption of advanced adhesives has enabled continuous technological development in the electronics industry. In certain applications, adhesives can replace soldering processes while also providing shielding and component encapsulation. Moreover, some complex materials cannot be soldered due to their high thermal sensitivity.
Precision Under Productivity
In addition to providing strong bonding performance, a key requirement for adhesives in electronic applications is the ability to achieve precise dispensing under high-productivity conditions. This demands advanced dispensing equipment with accurate volume control and consistent performance.
Role in PCB & Chip Assembly
Encapsulation dispensing plays an important role in PCB and chip assembly processes. It is mainly used for bonding, sealing, and waterproof protection of PCB-mounted chips and electronic components. Proper encapsulation effectively improves reliability, enhances environmental protection, and extends the service life of chips on PCB assemblies. In electronic chip encapsulation processes, precision dispensing machines are commonly used, as they offer high efficiency, stable operation, and consistent dispensing performance.
Industry Applications
Process Characteristics
Full Encapsulation
Components must be completely covered with adhesive without voids or unfilled areas for maximum protection.
Lead Coating
Leads and solder joints must be fully coated with adhesive while keeping designated areas free.
Overflow Control
Adhesive overflow width must be controlled within a specified range to maintain precision.
Industry Development Trend
As electronic components continue to move toward higher integration, precise control of adhesive volume and overflow width has become a key development trend in the industry. Advanced dispensing systems with intelligent volume control are essential for meeting these evolving requirements.