Chip encapsulation dispensing plays a critical role in electronic circuit board and semiconductor assembly. It is mainly used for PCB chip bonding, sealing, and waterproof protection, effectively extending the service life and operational reliability of electronic products. Through stable and precise dispensing control, encapsulation processes provide long-term performance assurance for electronic devices and support continuous technological advancement within the electronics industry. In most applications, high-precision dispensing systems are adopted to ensure consistent quality, high efficiency, and stable operation throughout the production process.
The chip dispensing process typically adopts a multi-axis coordinated dispensing mode. During encapsulation, the system is capable of accurately filling and sealing irregular gaps around chips and electronic components. It supports high-speed dispensing of dots, lines, surfaces, curves, and complex paths in a single operation, fully meeting the requirements of modern chip encapsulation processes. By optimizing dispensing parameters, the system achieves precise control of adhesive volume, dispensing pressure, and dispensing speed, significantly improving process stability and repeatability. With an advanced proportional control system, multiple material handling and mixing methods are supported. Once parameters are configured, the dispensing system can automatically execute chip encapsulation tasks, effectively reducing labor input and overall production costs.
In chip encapsulation dispensing applications, materials such as epoxy resin adhesives and UV adhesives are commonly used. Through accurate temperature control, the dispensing system ensures that adhesives remain in an optimal working state, preventing issues such as premature curing or unstable flow during production. Dispensing temperature is adjusted according to material characteristics to maintain consistent output quality. The system is equipped with a precision suck-back valve, which effectively prevents stringing and tailing during dispensing, ensuring uniform encapsulation results. This greatly improves process consistency, production stability, and overall yield rate, helping manufacturers achieve higher economic efficiency.
Chips are widely used across multiple industries, especially in applications with high thermal management requirements, including LED lighting, communication equipment, automotive electronics, semiconductors, power modules, optical modules, and consumer electronics. During thermal interface material dispensing, precise control of adhesive volume, dispensing accuracy, output speed, and dispensing path planning is essential to ensure bubble-free bonding, complete coverage, and uniform adhesive thickness after assembly.
As chip integration density continues to increase, power density per unit area rises accordingly, placing higher demands on heat dissipation performance. To address this challenge, thermal material manufacturers continuously increase metal filler content to enhance thermal conductivity. This trend imposes higher requirements on dispensing systems in terms of wear resistance, dispensing speed stability, and adhesive volume consistency. As a result, high-precision and high-reliability dispensing solutions have become a critical factor in ensuring long-term product performance and reliability in advanced electronics manufacturing.