Smartphone TP-to-Bracket Bonding & Sealing Dispensing
PUR hot-melt adhesive dispensing solutions for narrow-bezel full-screen smartphone assembly, ensuring stable bonding and reliable sealing performance
Limitations of Traditional Methods
For traditional non–full-screen smartphones, double-sided adhesive tape was sufficient to bond the TP screen to the frame. However, this method no longer meets the structural, reliability, and sealing requirements of narrow-bezel full-screen smartphones. Manufacturers must now consider multiple process requirements including bonding strength, sealing performance, rework capability, and long-term reliability.
Adhesive Bonding Technology
Under narrow-bezel conditions, adhesive bonding has become the only viable solution for connecting the TP touch panel to the support bracket. Modern smartphones are evolving toward integrated structures, screw-free assembly, and full-screen designs. Ensuring stable and reliable dispensing process performance has become critical for meeting these demands.
Complete Dispensing Solution
SANCO provides a dedicated dispensing process solution based on material performance and equipment capability
Adhesive Selection
For TP and bracket bonding applications requiring controlled curing and rework capability, PUR hot-melt adhesive is recommended as the optimal solution.
Process Solution
Standard PUR hot-melt adhesive dispensing workflow with optimized parameters and quality control at every step.
Equipment Solution
From desktop to inline systems, SANCO offers equipment options for various production scales and precision requirements.
PUR Hot-Melt Adhesive Properties
Compatible with a wide range of substrates for electronics bonding applications
Standard PUR Dispensing Workflow
Recommended Equipment
DV Series Vision Dispensing Machine
Equipped with CCD vision recognition system, supports template import. Suitable for small to medium enterprises and small-batch production with single-operator dispensing.
HSD Series Online Intelligent Dispensing
High-resolution industrial cameras with AI-based recognition, integrated conveyor systems and full production line compatibility. Enables fully automated, unattended operation for large-scale manufacturing.
Key Operating Considerations
Important tips for PUR hot-melt adhesive dispensing process
Bonding Time Window
Complete component bonding within 2 minutes after adhesive application (depends on ambient temperature and humidity)
Temperature Control
Ensure accurate temperature control; dispensing begins only after reaching the preset temperature
Heating Duration
Continuous heating time should not exceed 4 hours; same cartridge should not be reheated more than 3 times
Safety Procedures
Follow safety procedures and wear protective gloves to prevent burns during operation