Electronics Manufacturing
High-precision dispensing solutions for PCB assembly, component mounting, and electronic device manufacturing with industry-leading accuracy and repeatability.
Industry Overview
The electronics industry demands the highest precision in adhesive dispensing. From SMT assembly lines to advanced chip packaging, every microliter counts. Our dispensing solutions deliver consistent, repeatable results that meet the stringent quality requirements of modern electronics manufacturing.
With increasing miniaturization and higher component density on PCBs, traditional dispensing methods often fall short. Our advanced piezo valve technology and precision motion systems ensure accurate adhesive placement even for the smallest components, helping you maintain yield rates and reduce defects.
Key Application Areas
Our dispensing solutions cover the full spectrum of electronics manufacturing processes
SMT Assembly
Red glue and adhesive dispensing for surface mount component fixation before wave soldering or reflow processes.
Chip Packaging
Underfill dispensing, die bonding, and encapsulation for semiconductor devices and advanced packaging.
Conformal Coating
Selective coating for PCB protection against moisture, dust, chemicals, and environmental factors.
FPC Reinforcement
Adhesive dispensing for flexible circuit board reinforcement and connector bonding applications.
Display Bonding
Optical adhesive dispensing for LCD/OLED display assembly with bubble-free bonding quality.
Camera Modules
Precision dispensing for lens bonding, sensor attachment, and optical assembly processes.
Why Choose Our Solutions
Industry-leading technology for electronics manufacturing
±0.02mm Accuracy
Ultra-precise positioning for fine-pitch components
High Speed
Up to 800mm/s dispensing speed
Repeatability
±1% volume consistency for every dispense
Easy Programming
Intuitive software with CAD import support
Recommended Products
Dispensing equipment optimized for electronics applications